Intel announced the all new Intel Lakefield processors for Foldable and Dual Screen PCs. This new chipset is to built with 3D chip-stacking technology and offers improvement in both speed and performance as per the company. The upcoming Samsung Galaxy Book S, will be the first device to ship with a Lakefield SoC. Let’s check more details on this processor.
Intel Lakefield Processor Details
The new Intel Lakefield processor is built around all new design with hybrid CPU architecture combining power-efficient Tremont cores with 10nm Sunny Cove cores. The design of the SoC is divided into three layers, stacked upon each other: a 14nm-built lower die features I/O connections and a 10nm CPU that features one large compute core and four smaller Atom-based ‘efficiency’ cores. The DRAM is stacked atop the 3D processor in a PoP (package-on-Package) package.
This architecture improves power efficiency and graphics performance. The use of Intel’s Foveros 3D stacking technology helps in this regard. This new chipset from Intel will compete against the Qualcomm’s 8cx processor. As highlighted already, this chipset is specifically designed for always-on laptops with long battery life and efficient performance.
The Samsung Galaxy Book S will be the first device to sport this processor in commercial market. Apart from this, Lenovo Thinkpad X1 the world’s first foldable laptop will also be powered by this new Intel processor. Microsoft Surface Neo was expected to launch with this processor but for now no details or confirmation available on the same.